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Home > Taconic PCB > Taconic TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 High Frequency PCB with HASL, Immersion Gold, Silver, Tin and OSP
Taconic TLX-0, TLX-9, TLX-8, TLX-7 and TLX-6 High Frequency PCB with HASL, Immersion Gold, Silver, Tin and OSP

(Printed Circuit Boards are custom-made products; the picture and parameters shown are just for reference)


TLX High Frequency PCB Overview

Hello Everyone,
Today, we will discuss TLX high-frequency PCBs.


TLX is a series of PTFE fiberglass laminates introduced by Taconic Company, known for their reliability in various RF applications. This material is versatile, offering a dielectric constant (DK) range of 2.45 to 2.65, making it suitable for low layer count microwave PCBs.


Advantages of TLX

Dimensionally Stable: TLX can withstand high levels of vibration, making it ideal for applications such as space launches.
Excellent Thermal Properties: It can endure high temperature exposure, suitable for use in engine modules.
Low and Stable Dielectric Constant: TLX features a tightly controlled dielectric constant ranging from 2.45 to 2.65, with a tolerance of ±0.04.
Low Moisture Absorption: This material performs well in extreme environments, such as marine conditions.
Flame Retardant Grade: TLX meets UL 94 V-0 standards for flame retardancy.
Low Dissipation Factor: It ensures minimal energy loss during operation.



Applications:

TLX is an ideal material for several applications due to its broad DK range and available thickness and copper cladding options, including:

1.Radar systems
2.Mobile communications
3.Microwave test equipment
4.Microwave transmission devices
5.Antennas
6.Mixers, splitters, filters, and combiners


The TLX family includes TLX-0, TLX-9, TLX-8, TLX-7, and TLX-6. It is commonly used in single-layer and double-layer boards, with surface finishes primarily in bare copper, hot air leveling (HASL), and immersion gold.


PCB Capabilities (TLX)

PCB Material:

PTFE Fiberglass

TLX Family (Dielectric constant ±0.04)

TLX-0 (DK=2.45)

TLX-9 (DK=2.50)

TLX-8 (DK=2.55)

TLX-7 (DK=2.60)

TLX-6 (DK=2.65)

Layer count:

1 Layer, 2 Layer, 4 Layer.

Copper weight:

0.5oz, 1oz, 2oz

PCB thickness:

0.5mm, 0.8mm, 1.0mm,

1.5mm,  3.2mm

PCB Size:

≤400mm X 500mm

Surface finish:

Bare copper, HASL, ENIG, Immersion tin etc.



The basic colors of TLX high-frequency PCBs are brown and black.


We specialize in providing prototype services, small batches, and mass production. If you have any requirements for this type of PCB, please feel free to contact us.


Thank you for reading!


Appendix: Data Sheet of TLX-8

Click to expand/collapse the table

TLX-8 TYPICAL VALUES

Property

Test Method

Unit

Value

Unit

Value

DK @10 GHz

IPC-650 2.5.5.3

 

2.55

 

2.55

Df @1.9 GHz

IPC-650 2.5.5.5.1

 

0.0012

 

0.0012

Df @10 GHz

IPC-650 2.5.5.5.1

 

0.0017

 

0.0017

Dielectric Breakdown

IPC-650 2.5.6

kV

>45

kV

>45

Moisture Absorption

IPC-650 2.6.2.1

%

0.02

%

0.02

Flexural Strength(MD)

ASTM D 709

psi

28,900

N/mm2

 

Flexural Strength(CD)

ASTM D 709

psi

20,600

N/mm2

 

Tensile Strength(MD)

ASTM D 902

psi

35,600

N/mm2

 

Tensile Strength(CD)

ASTM D 902

psi

27,500

N/mm2

 

Elongation at Break(MD)

ASTM D 902

%

3.94

%

3.94

Elongation at Break(CD)

ASTM D 902

%

3.92

%

3.92

Young's Modulus(MD)

ASTM D 902

kpsi

980

N/mm2

 

Young's Modulus(CD)

ASTM D 902

kpsi

1,200

N/mm2

 

Young's Modulus(MD)

ASTM D 3039

kpsi

1,630

N/mm2

 

Poisson's Ratio

ASTM D 3039

 

0.135

N/mm

 

Peel Stength(1 oz.ed)

IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)

Ibs./linear inch

15

N/mm

 

Peel Stength(1 oz.RTF)

IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)

Ibs./linear inch

17

N/mm

 

Peel Stength(½ oz.ed)

IPC-650 2.4.8.3(Elevated Temp.)

Ibs./linear inch

14

N/mm

 

Peel Stength(½ oz.ed)

IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)

Ibs./linear inch

11

N/mm

 

Peel Stength(1 oz.rolled)

IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.)

Ibs./linear inch

13

N/mm

2.1

Thermal Conductivity

ASTM F433/ASTM 1530-06

W/M*K

0.19

W/M*K

0.19

Dimensional Stability(MD)

IPC-650 2.4.39 Sec.5.5(After Bake.)

mils/in.

0.06

mm/M

 

Dimensional Stability(CD)

IPC-650 2.4.39 Sec.5.4(After Bake.)

mils/in.

0.08

mm/M

 

Dimensional Stability(MD)

IPC-650 2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

0.09

mm/M

 

Dimensional Stability(CD)

IPC-650 2.4.39 Sec.5.5(Thermal Stress.)

mils/in.

0.1

mm/M

 

Surface Resistivity

IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)

Mohm

6.605 x 108

Mohm

6.605 x 108

Surface Resistivity

IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)

Mohm

3.550 x 106

Mohm

3.550 x 106

Volume Resistivity

IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.)

Mohm/cm

1.110 x 1010

Mohm/cm

1.110 x 1010

Volume Resistivity

IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.)

Mohm/cm

1.046 x 1010

Mohm/cm

1.046 x 1010

CTE(X axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

21

ppm/℃

21

CTE(Y axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

23

ppm/℃

23

CTE(Z axis)(25-260℃)

IPC-650 2.4.41/ASTM D 3386

ppm/℃

215

ppm/℃

215

Density(Specific Gravity)

ASTM D 792

g/cm3

2.25

g/cm3

2.25

Td(2% Weight Loss)

IPC-650 2.4.24.6(TGA)

℃

535

℃

 

Td(5% Weight Loss)

IPC-650 2.4.24.6(TGA)

℃

553

℃

 

Flammability Rating

UL-94

 

V-0

 

V-0



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